| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light source device with high heat dissipation, using a compact semiconductor light-emitting device. <P>SOLUTION: The light source device comprises: a semiconductor light-emitting device 110; a mounting substrate 250; a first connection material 230a; and a second connection material 230b. The semiconductor light-emitting device includes: a light-emitting part 10d; a first conductive part 30a; a second conductive part 30b; a sealing part 50; and an optical layer 60. The mounting substrate includes a base substrate 201, a first substrate electrode 210a, and a second substrate electrode 210b. The connection materials electrically interconnect the conductive parts and the substrate electrodes. The first and second conductive parts are electrically connected to the electrodes of the light-emitting parts, and include a first and second column parts that are vertically arranged on a second primary surface. The sealing part covers the side surfaces of the first and second conductive parts. The optical layer includes a wavelength conversion section and is provided on the opposite side of the second primary surface of a semiconductor laminate. The area of the second substrate electrode is more than 100 times the sectional area of the second column part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
