| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board capable of improving connection reliability for a mounting board such as a mother board, and with an electronic component or the like such as a semiconductor chip, and provide a manufacturing method of the wiring board. <P>SOLUTION: The wiring board is formed by alternately laminating a plurality of wiring layers and a plurality of insulation layers constituted from insulation resin, and in the top insulation layer covering the top wiring layer, there is formed an opening by which a part of the top wiring layer is exposed. A cross section of a side wall of the opening is shaped in a recessed R, and a recess is formed in the top wiring layer at a portion exposed by the opening. <P>COPYRIGHT: (C)2012,JPO&INPIT |
