发明名称 |
Led Module having a Platform with a Central Recession |
摘要 |
An LED module comprises a platform having a recession, wherein the recession presents a center section with a bottom and an enlarged section surrounding the center portion. An LED chip is arranged on the bottom of the center section. A bond wire leads from the LED chip to the bottom of the enlarged section in order to contact a first electrode of the LED chip. In one embodiment the bond wire is electrically connected to the back side of the platform by means of a through contact leading from the bottom of the enlarged section through the platform to the backside of the platform. In another embodiment a first conducting path leads from a first electrode of the LED chip across the side wall of the recession to the surface of the platform and from there across a lateral wall of the platform to the back side of the platform. A second conducting path, electrically isolated from the first conducting path, leads from a second electrode of the LED chip across the side wall of the recession to the to surface of the platform and from there across a lateral wall of the platform to the back side of the platform.
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申请公布号 |
US2011309396(A1) |
申请公布日期 |
2011.12.22 |
申请号 |
US20090935559 |
申请日期 |
2009.04.01 |
申请人 |
LEDON LIGHTING JENNERSDORF GMBH |
发明人 |
WANG YANGI;KAWAGUCHI HIROAKI;WAGNER FRIEDRICH |
分类号 |
H01L33/50;H01L29/02;H01L33/48;H01L33/54;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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