发明名称 Led Module having a Platform with a Central Recession
摘要 An LED module comprises a platform having a recession, wherein the recession presents a center section with a bottom and an enlarged section surrounding the center portion. An LED chip is arranged on the bottom of the center section. A bond wire leads from the LED chip to the bottom of the enlarged section in order to contact a first electrode of the LED chip. In one embodiment the bond wire is electrically connected to the back side of the platform by means of a through contact leading from the bottom of the enlarged section through the platform to the backside of the platform. In another embodiment a first conducting path leads from a first electrode of the LED chip across the side wall of the recession to the surface of the platform and from there across a lateral wall of the platform to the back side of the platform. A second conducting path, electrically isolated from the first conducting path, leads from a second electrode of the LED chip across the side wall of the recession to the to surface of the platform and from there across a lateral wall of the platform to the back side of the platform.
申请公布号 US2011309396(A1) 申请公布日期 2011.12.22
申请号 US20090935559 申请日期 2009.04.01
申请人 LEDON LIGHTING JENNERSDORF GMBH 发明人 WANG YANGI;KAWAGUCHI HIROAKI;WAGNER FRIEDRICH
分类号 H01L33/50;H01L29/02;H01L33/48;H01L33/54;H01L33/62 主分类号 H01L33/50
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