发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
The present invention provides a printed circuit board including: an insulating member having a through via hole; a circuit pattern disposed on the insulating member; a solder resist disposed on the insulating member while exposing a portion of the circuit pattern; a via plating pad connected to the circuit pattern, disposed inside the via hole, and covering a lower opening of the via hole along an inner wall of the via hole; and an external connection means having a center portion coinciding with a center portion of the via hole and disposed on the via plating pad, and a method of manufacturing the same.
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申请公布号 |
US2011308845(A1) |
申请公布日期 |
2011.12.22 |
申请号 |
US201113164055 |
申请日期 |
2011.06.20 |
申请人 |
CHO SUK HYEON;PARK JUNG HYUN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO SUK HYEON;PARK JUNG HYUN |
分类号 |
H05K1/09;H05K1/11;H05K3/42 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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