发明名称 |
OPTICALLY TUNED METALIZED LIGHT TO HEAT CONVERSION LAYER FOR WAFER SUPPORT SYSTEM |
摘要 |
The present invention is a laminated body including a substrate, a joining layer positioned adjacent the substrate, a photothermal conversion layer positioned adjacent the joining layer, and a light transmitting support positioned adjacent the photothermal conversion layer. The photothermal conversion layer includes a metal absorbing layer. |
申请公布号 |
WO2011159456(A2) |
申请公布日期 |
2011.12.22 |
申请号 |
WO2011US38281 |
申请日期 |
2011.05.27 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY;TRAN, HUNG T.;SAITO, KAZUTA |
发明人 |
TRAN, HUNG T.;SAITO, KAZUTA |
分类号 |
H01L21/683 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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