发明名称 OPTICALLY TUNED METALIZED LIGHT TO HEAT CONVERSION LAYER FOR WAFER SUPPORT SYSTEM
摘要 The present invention is a laminated body including a substrate, a joining layer positioned adjacent the substrate, a photothermal conversion layer positioned adjacent the joining layer, and a light transmitting support positioned adjacent the photothermal conversion layer. The photothermal conversion layer includes a metal absorbing layer.
申请公布号 WO2011159456(A2) 申请公布日期 2011.12.22
申请号 WO2011US38281 申请日期 2011.05.27
申请人 3M INNOVATIVE PROPERTIES COMPANY;TRAN, HUNG T.;SAITO, KAZUTA 发明人 TRAN, HUNG T.;SAITO, KAZUTA
分类号 H01L21/683 主分类号 H01L21/683
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