METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT ASSEMBLY USING METAL NANOPARTICLE PASTE, LED MODULE, AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD

摘要

Disclosed is a metal nanoparticle paste that uses the low-temperature sintering characteristics of metal nanoparticles to easily obtain a metal bond with excellent conductivity and mechanical strength, and which can form a wiring pattern with excellent conductivity. The metal nanoparticle paste is characterized by containing (A) metal nanoparticles, (B) a protective film that coats the surface of the metal nanoparticles, (C) a carboxylic acid, and (D) a dispersion medium.