APPARATUS AND METHOD FOR CLEANING PLATES

摘要

PURPOSE: An apparatus and method for cleaning surface plates are provided to increase cleaning efficiency and reduce cleaning times by washing an upper surface plate and a bottom surface plate which are used for polishing a wafer. CONSTITUTION: A surface plate is composed of an upper surface plate(101) and a bottom surface plate(102). An elevating cylinder(103) controls the separation distance between the upper surface plate and the bottom surface plate. An emission unit(110) simultaneously sprays high pressure fluid to the upper surface plate and the bottom surface plate. A robot arm(120) relatively moves the emission unit to the surface plate. A fluid supplying unit(130) supplies the high pressure fluid to the emission unit.