发明名称 |
CONDUCTIVE MATERIAL WITH Sn ALLOY PLATING AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To easily and surely form a thin Sn-Ag alloy layer with a uniform structure without depending on an electroplating method. <P>SOLUTION: A method of manufacturing a conductive material with an Sn alloy plating includes: an Sn plating layer forming step of forming an Sn plating layer composed of Sn or an Sn alloy on a base material made of Cu or a Cu alloy; an Ag nanoparticle film forming step of forming an Ag nanoparticle film dispersed with Ag nanoparticles on the Sn plating layer by applying a mixed solution of water containing the Ag nanoparticles composed of Ag or an Ag alloy in which a protective agent is chemically modified, alcohol, an organic binder or an organic solvent; and an Sn-Ag alloy layer forming step of forming the Sn-Ag alloy layer obtained by alloying the Sn or the Sn alloy of the Sn plating layer and the Ag or the Ag alloy of the Ag nanoparticle film on the surface of the Sn plating layer by a reflow step. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011256459(A) |
申请公布日期 |
2011.12.22 |
申请号 |
JP20100217097 |
申请日期 |
2010.09.28 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
TARUTANI YOSHIE;YAMAZAKI KAZUHIKO;KATO NAOKI |
分类号 |
C23C28/02;C23C24/08;C25D7/12 |
主分类号 |
C23C28/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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