| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly practical photosensitive resin composition which is excellent in heat resistance, thermal cycle resistance and insulation reliability. <P>SOLUTION: A photosensitive resin composition contains (A) an epoxy (meth)acrylate compound, (B) an urethane (meth)acrylate compound, (C) a polymerizable compound having one or more unsaturated double bonds in one molecule, (D) a photopolymerization initiator and (E) a thermal polymerization catalyst. The (A) epoxy (meth)acrylate compound is obtained by allowing an unsaturated group-containing dicarboxylic acid compound (a) to react with an epoxy compound (b) having two epoxy groups in one molecule and with an unsaturated group-containing monocarboxylic acid compound (c), and further allowing the obtained reaction product to react with a polybasic acid anhydride (d). <P>COPYRIGHT: (C)2012,JPO&INPIT |
