| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition for forming an insulating film which is capable of reducing a dielectric constant of a formed insulating film. <P>SOLUTION: A photosensitive composition for forming an insulating film, which comprises a silsesquioxane resin(A) having a structural unit(a1) represented by the following general formula(I) and a structural unit(a2) represented by the following general formula(II), an acid generator component(B) that generates an acid by exposure, and a crosslinker component(C), is used. In the following general formula(I), R<SP POS="POST">1</SP>is an alkylene group having 1-5 carbon atoms, and n is an integer of 1-5. In the following general formula(II), R<SP POS="POST">2</SP>is an alkyl group having 1-10 carbon atoms. <P>COPYRIGHT: (C)2012,JPO&INPIT |
