| 发明名称 |
EMI NOISE SHIELD BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an EMI noise shield board including an electromagnetic bandgap structure (EBG). <P>SOLUTION: The EMI noise shield board in accordance with the present invention comprises: a first board portion on whose upper surface an electronic part is mounted and in which a circuit for transferring a signal and power to the electronic part is provided; and a second board portion which is located on a lower surface of the first board portion and into which an electromagnetic bandgap structure is inserted. The electromagnetic bandgap structure has a band stop frequency property in such a way that an EMI noise transferred from the first board portion can be shielded from being radiated to the outside of the board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2011258910(A) |
申请公布日期 |
2011.12.22 |
| 申请号 |
JP20100203868 |
申请日期 |
2010.09.13 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM HAN;HAN MI-JA;PARK DAE-HYUN;JEONG HYO-JIK;PONG KANG SEONG |
| 分类号 |
H01L23/12;H01L23/00;H01L23/28 |
主分类号 |
H01L23/12 |
| 代理机构 |
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