| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling system for an electronic component. <P>SOLUTION: The cooling system comprises a plurality of thermoelectric elements that are disposed above a plurality of different areas of the electronic component, respectively. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the individual areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas. <P>COPYRIGHT: (C)2012,JPO&INPIT |
