| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering device capable of soldering two target parts by heating them with a small number of heat sources. <P>SOLUTION: A power module Mp and an upper electrode 54, which are soldering targets, are positioned by a lower jig 21 and a coupling part 22 of a soldering device 10. Unmelted solder 24 to be supplied is held by an upper jig 23. The power module Mp and the upper electrode 54 are heated by heating the lower jig 21 and the coupling part 22 by means of a heating plate 30. At the same time, the upper jig 23 is heated to heat the solid spherical solder 24 so that the solder is supplied to the power module Mp and the upper electrode 54. <P>COPYRIGHT: (C)2012,JPO&INPIT |
