发明名称 ELECTRONIC APPARATUS HOUSING
摘要 <P>PROBLEM TO BE SOLVED: To suppress radio wave leakage due to signal transmission between modules and prevent the deterioration of the electrical performance in an electric apparatus housing in which the modules are connected in multiple stages. <P>SOLUTION: The electric apparatus housing includes a chassis which has a housing part for housing a substrate, having a signal transmission line to connect multiple electronic modules thereon; a cover contacting with an upper surface of the housing part of the chassis and having a groove on a lower surface; and a shield plate which is erected from the substrate so as to contact with an upper surface of the substrate between the electronic modules and fixed with screws inserted from the back side of the substrate, while an upper portion of the shield plate fits into the groove of the cover and a through groove, through which the signal transmission line passes, is provided at a lower portion of the shield plate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011258748(A) 申请公布日期 2011.12.22
申请号 JP20100131940 申请日期 2010.06.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIRANO TAKUYA
分类号 H05K9/00 主分类号 H05K9/00
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