发明名称 THERMALLY CONDUCTIVE SHEET AND PROCESS FOR PRODUCING SAME
摘要 Provided is a thermally conductive sheet which has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces and which has high thermal conductivity in the thickness direction. The thermally conductive sheet is hence suitable for use as a member to be interposed between any of various heat sources and a radiation member. Also provided is a process for producing the thermally conductive sheet. The process for producing the thermally conductive sheet comprises: an extrusion molding step in which a thermally conductive composition comprising a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded object in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded object is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.
申请公布号 WO2011158942(A1) 申请公布日期 2011.12.22
申请号 WO2011JP63955 申请日期 2011.06.17
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION;ARAMAKI, KEISUKE;USUI, HIROYUKI 发明人 ARAMAKI, KEISUKE;USUI, HIROYUKI
分类号 C08J5/18;C08K3/00;C08K7/06;C08L83/04;H01L23/36 主分类号 C08J5/18
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