发明名称 Method and Structure of Forming Silicide and Diffusion Barrier Layer With Direct Deposited Film on Silicon
摘要 A semiconductor device or a photovoltaic cell having a contact structure, which includes a silicon (Si) substrate; a metal alloy layer deposited on the silicon substrate; a metal silicide layer and a diffusion layer formed simultaneously from thermal annealing the metal alloy layer; and a metal layer deposited on the metal silicide and barrier layers.
申请公布号 US2011309508(A1) 申请公布日期 2011.12.22
申请号 US20100819634 申请日期 2010.06.21
申请人 CABRAL, JR. CYRIL;COTTE JOHN M.;FISHER KATHRYN C.;KOSBAR LAURA L.;LAVOIE CHRISTIAN;LIU ZHU;RODBELL KENNETH P.;SHAO XIAOYAN;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CABRAL, JR. CYRIL;COTTE JOHN M.;FISHER KATHRYN C.;KOSBAR LAURA L.;LAVOIE CHRISTIAN;LIU ZHU;RODBELL KENNETH P.;SHAO XIAOYAN
分类号 H01L23/485;H01L21/768 主分类号 H01L23/485
代理机构 代理人
主权项
地址