发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
PURPOSE: A photo-sensitive resin composition and an adhesive film coated with the composition are provided to implement a patterning process through an exposing process and a developing process. CONSTITUTION: A photo-sensitive resin composition includes 100 parts by weight of (meta)acryl-based polymer and 0.5-10 parts by weight of a photo-polymerization initiator. A carboxylic group and a reactive double bond are arranged at the side chain of the (meta)acryl-based polymer. The acid value of the (meta)acryl-based polymer is between 65 and 180 KOH mg/g. The glass transition temperature of the (meta)acryl-based polymer is between -60 and -25 degrees Celsius. The average molecular weight of the (meta)acryl-based polymer is between 10000 and 300000.
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申请公布号 |
KR20110137212(A) |
申请公布日期 |
2011.12.22 |
申请号 |
KR20100057306 |
申请日期 |
2010.06.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SUWA TATSUHIRO |
分类号 |
G03F7/027;C09J7/02;G03F7/028 |
主分类号 |
G03F7/027 |
代理机构 |
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