SEMICONDUCTOR DEVICE, CAMERA MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing the formation of gaps at a bonding interface between substrates.

SOLUTION: A semiconductor device comprises: a semiconductor substrate; an active layer formed on one surface of the semiconductor substrate; a wiring layer formed on the active layer and having wiring which forms protrusions on a surface that does not come into contact with the active layer; an insulating layer formed on the wiring layer such that a region excluding the portions above the wiring is formed as a recess; an embedded layer arranged on the recess of the insulating layer; a bonding layer arranged on the insulating layer and the embedded layer; and a substrate bonded to the bonding layer so as to face the surface of the semiconductor substrate.

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