INSPECTION PROBE, INSPECTION METHOD, AND INSPECTION SYSTEM

摘要

PROBLEM TO BE SOLVED: To conduct an insulation test after checking the contact condition between an electrode pad formed on a chip to be tested and a bump of an inspection probe so as to accurately determine the quality of the chip on the basis of the insulation test.

SOLUTION: The inspection probe is provided with terminal parts (101-1 to 101-n, 102-1 to 102-n) in which at least two contact points to contact with an electrode pad formed on a circuit board are arranged, and a plurality of signal lines (103-1 to 103-n) connected to each of the contact points of the terminal part.

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