发明名称 |
SYSTEMS AND METHODS FOR REDUCING OVERHANG ON ELECTROPLATED SURFACES OF PRINTED CIRCUIT BOARDS |
摘要 |
<p>A method and system for reducing overhang on electroplated surfaces of printed circuit boards including applying a first resist layer on a substrate having a first copper layer, applying a first image to the first resist layer, developing the first resist layer in accordance with the first image, applying a second copper layer on the first copper layer, electroplating a first metallic layer on the second copper layer, removing the first resist layer, etching a portion of the first copper layer, removing the first metallic layer, depositing a third copper layer on a surface of the assembly, applying a second resist layer on the third copper layer, applying a second image to the second resist layer, developing the second resist layer in accordance with the second image, electroplating a preselected metal layer on the third copper layer, removing the second resist layer, and etching a portion of the third copper layer.</p> |
申请公布号 |
WO2011159929(A1) |
申请公布日期 |
2011.12.22 |
申请号 |
WO2011US40752 |
申请日期 |
2011.06.16 |
申请人 |
DDI GLOBAL CORP.;SIDHU, RAJWANT, S.;ZEPEDA, RUBEN, A.;LOPEZ, CARLOS, A. |
发明人 |
SIDHU, RAJWANT, S.;ZEPEDA, RUBEN, A.;LOPEZ, CARLOS, A. |
分类号 |
G03F7/00;H01L21/00 |
主分类号 |
G03F7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|