FLIP CHIP MLP WITH CONDUCTIVE INK

摘要

The invention provides a flip chip molded leadless package (MLP) with electrical paths printed in conducting ink. The MLP includes a taped Ieadframe with a plurality of leads and a non-conducting tape placed thereon. The electrical paths are printed on the tape to connect the features of the semiconductor device to the ieads and an encapsulation layer protects the package. In a second embodiment, the MLP includes a pre-molded leadframe with the electrical paths printed directly thereon. The present invention also provides a method of fabricating the semiconductor package according to each embodiment.