| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor device and its manufacturing method capable of reducing manufacturing cost in the case of packaging the device, capable of easy change of a connection relationship to meet any other element specification, capable of enhancing the reliability of the joining of the substrate with the package, and capable of materializing a lower-profile packaged sensor device as a whole. <P>SOLUTION: The sensor device includes: a first substrate; an MEMS element that is disposed on the first substrate and has a movable part; a first support disposed discontinuously at the periphery of the movable part of the MEMS element; a second substrate fixed to the first support to cover at least the movable part; a first terminal disposed at the outer side of the first support; and a first wiring that is electrically connected with the first terminal and transmits an electric signal based on the displacement of the movable part. The first wiring passes through a discontinuous site of the first support. <P>COPYRIGHT: (C)2012,JPO&INPIT |
