发明名称 |
SILICON CARBIDE SUBSTRATE, SUBSTRATE WITH EPITAXIAL LAYER, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicon carbide substrate which can reduce on-resistance, and to provide a substrate with an epitaxial layer, a semiconductor device and a method of manufacturing a silicon carbide substrate. <P>SOLUTION: The silicon carbide substrate 10 having a principal face comprises an SiC single crystal substrate 1 formed at least partially on the principal face, and a base member 20 arranged to surround the periphery of the SiC single crystal substrate 1. The base member 20 includes a boundary region 11 and an underlying region 12. The boundary region 11 is contiguous to the SiC single crystal substrate 1 in the direction along the principal face, and has a grain boundary internally. The underlying region 12 is contiguous to the SiC single crystal substrate 1 in the direction perpendicular to the principal face, and has an impurity concentration higher than that in the SiC single crystal substrate 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011258768(A) |
申请公布日期 |
2011.12.22 |
申请号 |
JP20100132253 |
申请日期 |
2010.06.09 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
SHIOMI HIROSHI;TAMASO HIDETO;HARADA MAKOTO;TSUNO TAKASHI;NAMIKAWA YASUO |
分类号 |
H01L21/20;C30B29/36;H01L21/02;H01L21/205;H01L29/12;H01L29/47;H01L29/78;H01L29/872 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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