| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a detection method and a device for a void which exists in a glued wafer when manufacturing the glued wafer. <P>SOLUTION: When two wafers are glued and bonded together to manufacture a glued wafer, a void is detected in the glued wafer based on a transmission shape made by the boundary of a bonding part and a non-bonding part in the gluing process, the presence of a void in the glued wafer is judged by the contrast between the transmission shape in the wafer where no void is actually generated and the transmission shape in the glued wafer, the shape of a glued border is approximated by a quadratic curve to obtain a curvature at the apex of the quadratic curve, the obtained curvature and a curvature in the case where no void predetermined for every position of the glued border is generated are contrasted to obtain an error, and it is judged that there is the void in the glued wafer when the obtained error exceeds a prescribed value. <P>COPYRIGHT: (C)2012,JPO&INPIT |
