发明名称 |
A SENSOR AND METHOD FOR FABRICATING THE SAME |
摘要 |
A sensor and method for fabricating a sensor is disclosed that in one embodiment bonds an etched semiconductor substrate wafer to an etched first device wafer comprising a silicon on insulator wafer which is then bonded to a second device wafer comprising a silicon on insulator wafer to create a vented, suspended structure, the flexure of which is sensed by an embedded sensing element to measure differential pressure. In one embodiment, interconnect channels embedded in the sensor facilitate streamlined packaging of the device while accommodating interconnectivity with other devices. |
申请公布号 |
US2011309458(A1) |
申请公布日期 |
2011.12.22 |
申请号 |
US20100818635 |
申请日期 |
2010.06.18 |
申请人 |
GAMAGE SISIRA KANKANAM;MANTRAVADI NARESH VENKATA;KLITZKE MICHAEL;COOKSON TERRY LEE |
发明人 |
GAMAGE SISIRA KANKANAM;MANTRAVADI NARESH VENKATA;KLITZKE MICHAEL;COOKSON TERRY LEE |
分类号 |
H01L29/84;H01L21/30 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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