HEAT SINK FOR MEMORY MODULE

摘要

A heat sink for memory module includes two heat-sink plates and two fastening members. Each heat-sink plate defines two through holes. The through holes of one heat-sink plate are coaxial to the through holes of the other heat-sink plate. Each fastening member includes a first head portion and a second head portion. The first head portion is elastic and is allowed to be pushed to pass through the through holes. The two heat-sink plates are locked between the first head portion and the second head portion.