| 摘要 |
<P>PROBLEM TO BE SOLVED: To align a wafer and a pattern with high precision. <P>SOLUTION: Position of a stage is measured using a position measurement system, and the stage is driven based on the measurement results. Based on the detection results obtained by detecting an alignment mark of a wafer held on the stage by using an alignment system, and correction information (correction data given for the lattice points m<SB POS="POST">ij</SB>of an ideal lattice) dependent on the position of the stage for the detection results, the stage holding a wafer is driven so that a pattern formed on the wafer is arranged in ideal lattice shape. <P>COPYRIGHT: (C)2012,JPO&INPIT |
