| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance heat dissipation efficiency of wafer-level packaging (WLP) by a heat spreader. <P>SOLUTION: A semiconductor device 1 is equipped with a semiconductor substrate 11 which has an integrated circuit on the side of a principal surface 11a, wiring 23 and an electrode 25 which are formed on an insulator film 14 covering a passivation film 13, a light-shielding sealing layer 26 covering other than the electrode 25, and a heat spreader 30 which is disposed on a rear surface 11b of the semiconductor substrate 11. A peripheral portion 33 of the heat spreader 30 protrudes from the edge of the rear surface 11b of the semiconductor substrate 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
