PHOTOELECTRIC CONSOLIDATION CIRCUIT PACKAGING SUBSTRATE, PHOTOELECTRIC CONVERSION MODULE, TRANSMISSION DEVICE, AND SWITCH MODULE

摘要

PROBLEM TO BE SOLVED: To solve a problem in which high density optical wiring is difficult in optical wiring structure with a wavelength multiplex transmission method which is caused by upsizing in a conventional wavelength multiplexer demultiplexer with a plane arrangement type optical waveguide.

SOLUTION: An optical wiring structure is provided that uses a wavelength multiplexer demultiplexer capable of achieving high density integration by using the wavelength multiplexer demultiplexer with a lamination layer arrangement directive coupling optical waveguide in an optical wiring based on a wavelength multiplex transmission method.

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