| 摘要 |
<p>Disclosed are a tape adhesion device and tape adhesion method that are able to increase productivity and efficiently perform a tape-peeling operation while eliminating wastage of conductive tape. In the tape adhesion method, which severs a tape member (4) into fragmented conductive tape (4b*) and adheres the fragmented conductive tape (4b*) to a plurality of adhesion portions formed at the side edges (20a) of a substrate (20), the following steps are repeatedly executed: an adhesion step wherein fragmented conductive tape (4b*) is adhered to adhesion portions of a first pressed position (P1); and a moving step wherein, while integrally moving a pressure bonding head (15) and a peeling unit (17) relatively with respect to the substrate (20), the pressure bonding head (15) is positioned at the adhesion portions of a second pressure bonding position (P2) by means of driving a tape feed mechanism and performing a feed operation of the tape member (4), and a separator (4a) is peeled from the tape member (4), which was adhered to the first pressed position (P1), by means of the peeling unit (17) during the process of relative motion.</p> |
