| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC chip in a high frequency region, in particular, a package substrate free from any malfunction or error even when exceeding 3GHz. <P>SOLUTION: A conductor layer 34P on a core substrate 30 is formed to have a thickness of 30 μm, and a conductor circuit 58 on an interlayer resin insulation film 50 is formed to have a thickness of 15 μm. By increasing the thickness of the conductor layer 34P, the volume of the conductor itself can be increased and the resistance can be reduced. Moreover, by using a conductor layer 34 as a power supply layer, the performance of power supply from the power source to the IC chip can be improved. <P>COPYRIGHT: (C)2012,JPO&INPIT |
