THERMOSETTING EPOXY RESIN COMPOSITION, PRE-MOLD PACKAGE, LED DEVICE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition which gives a cured material capable of achieving the improvement of crack resistance by lowering an elasticity and a good light reflectance in an early period and maintaining such the properties for a long period of time; and to provide a pre-mold package, an LED device and a semiconductor device obtained by using the thermosetting epoxy resin.

SOLUTION: The thermosetting epoxy resin composition includes (A) a material obtained by mixing (A-1) a triazine derivative epoxy resin with (A-2) an acid anhydride, or a prepolymer obtained by reacting (A-1) the triazine derivative epoxy resin with (A-2) the acid anhydride, (B) a low stress material, (C) an inorganic filler and (D) a curing accelerator, wherein the low stress material as the component (B) is a silicone polymer expressed by following general formula (1): (R12SiO)l(R2R3SiO)m(R4SiO1.5)n.

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