| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve transferability of a complicated shape and productivity of glass molding, by a simple constitution. <P>SOLUTION: A glass molding apparatus includes: a die 27 for holding and releasing a glass material Ga; a pressurizing unit 20 pressurizing the glass material Ga via the die 27; a heater unit 29 heating the die 27; an ultrasonic wave applying unit 30 applying ultrasonic waves to the die 27 at an oscillation frequency of 2 to 200 kHz and also at an acceleration of 200 to 2,000 G; and a frame 11 supporting the die 27, the pressurizing unit 20 and the ultrasonic wave applying unit 30 on a floor surface. The ultrasonic wave applying unit 30 is supported by the frame 11 at the portion equivalent to the node portion of the ultrasonic wave applying unit. <P>COPYRIGHT: (C)2012,JPO&INPIT |
