| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device cooler which can enhance moisture resistance of an insulation layer and adhesion of a sealing resin. <P>SOLUTION: The semiconductor device cooler 1 comprises a top plate 12 having a top face 12a on which a semiconductor chip 11 is stacked with an insulation sheet 13 interposed therebetween, and an undersurface 12b which serves as a cooling medium contact surface. Both a protrusion 4 and a recess 5 are formed at an edge 3 touching a sealing resin 18 in a predetermined section D. Consequently, a semiconductor module 10 has both the protrusion 4 and recess 5 on an intrusion route of moisture and humidity intruding into the insulation sheet 13 from the outside, i.e. a route from the boundary B of the top plate 12 and the sealing resin 18 to the insulation sheet 13. Consequently, the intrusion route is elongated suitably and contact area of the top plate 12 and the sealing resin 18 increases. <P>COPYRIGHT: (C)2012,JPO&INPIT |
