SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, IN-MILLIMETER-WAVE DIELECTRIC TRANSMISSION DEVICE, METHOD OF MANUFACTURING THE SAME, AND IN-MILLIMETER-WAVE DIELECTRIC TRANSMISSION SYSTEM

摘要

Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.