SPUTTERING FILM FORMING DEVICE, AND ADHESION PREVENTING MEMBER

摘要

Provided are an adhesion preventing member from which a thin film deposited during the film forming process does not detach, and a sputtering film forming device having the adhesion preventing member. Adhesion preventing members (251-254, 35) are made from Al2O3, the arithmetic mean roughness of the adhesion surface of the film forming particles is 4µm - 10µm, and the deposited film is difficult to detach. In the sputtering film forming device, the adhesion preventing members (251-254, 35) are disposed in positions surrounding the peripheries of sputtering surfaces (231-234) of targets (211-214), and a position surrounding the periphery of the film formation surface of a substrate (31).