| 摘要 |
PURPOSE: A stacked semiconductor packages is provided to prevent a crack due to air expansion inside a void. CONSTITUTION: A substrate(100) has one side(111), the other side(112), and 4 lateral sides(113). A first semiconductor chip(200) is mounted on the one side of the substrate. A stacked semiconductor chip module(300) is formed on the first semiconductor chip. A support member supports the edge portion of the stacked semiconductor chip module. An underfill material(500) is filled in a space between the substrate, the first semiconductor chip, and a second semiconductor chip. An outer connector(600) is mounted on a borland(130) which is formed in the other side of the substrate.
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