| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board, by which the end point of wet etching of a metal film is accurately detected. <P>SOLUTION: The method for manufacturing a circuit board includes: a step for forming a second metal layer composed of a second metal material different from a first metal material on a board through at least a first metal layer composed of the first metal material; a step for forming a metal wiring pattern composed of a third metal material on the second metal layer; and an etching step for etching the second metal layer by wet etching in an etching solution to selectively remove the second metal layer to the first metal layer, after the step forming the metal wiring pattern. The wet etching step includes a step for measuring the time variation of the immersion potential of the second metal layer in the etching solution, and the wet etching step is finished when the immersion potential turns to increase after once reduced and further, a reduction in the time variation ratio of the immersion potential is detected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
