SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCTION THEREOF, AND MOUNTING BODY EQUIPPED WITH THE SEMICONDUCTOR DEVICE

摘要

Disclosed is a semiconductor device (1) comprising a semiconductor chip (11), a wiring substrate (10) which has the semiconductor chip (11) adhered on the upper surfaced thereof, a first land (13A) which is formed on the lower surface of the wiring substrate (10), a second land (13B) which is formed on the lower surface of the wiring substrate (10), a first bump electrode (14A) which is formed on the first land (13A), and a second bump electrode (14B) which is formed on the second land (13B). The height from the upper surface of the wiring substrate (10) to the second bump electrode (14B) is smaller than the height from the upper surface of the wiring substrate (10) to the first bump electrode (14A).