| 摘要 |
An optical package and a manufacturing method thereof are provided. The optical package includes an insulating layer including a hole, formed on a circuit pattern layer formed of a conductive material; an optical element bonded onto a portion of the circuit pattern layer, exposed through the hole; a connector electrically connecting the optical element and the circuit pattern layer; and a resin part burying the optical element and the connector. Accordingly, the optical package is formed using a tape board to reduce the volume and thickness of the optical package. Furthermore, a surface emission type package instead of a conventional dot emission type package can be manufactured to produce a highly integrated package. Moreover, encapsulation and formation of a lens are simultaneously performed to reduce the manufacturing cost and simplify the manufacturing process to improve productivity and increase optical efficiency through a light reflecting layer formed through plating. |
