PACKAGE STRUCTURE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR REPAIRING PACKAGE STRUCTURE

摘要

Disclosed is a package structure which is obtained by mounting an electronic component (2) on a circuit board (1) with a bonding metal (3). In the package structure, a flux (4) contains a compound having a hydroxyl group and remains on the surface of the bonding metal (3), a coating resin (5) contains 10-50% by weight of an isocyanate, and a reaction product (8) of the coating resin (5) and the flux (4) is formed on the interface between the flux (4) and the coating resin (5). Waterproof and moisture-proof properties can be obtained without cleaning the flux (4). The coating resin (5) can be easily separated by being heated to a temperature that is not less than the glass transition temperature of the flux (4).