Manufacturing method of metallic contact structure of e.g. metal wrap through solar cell, involves applying glass frit pastes to insulating layer on substrate, and making silver pastes to electrically contact substrate indirectly

摘要

The method involves forming a metal particle portion containing paste, at several local areas of a semiconductor substrate (1), and forming an auxiliary metal particle portion containing paste in a state covering the metal particle portion. The semiconductor substrate is heated. The glass frit pastes (3a,3b) are applied to an insulating layer (2) on substrate to form electrical conductive contact with substrate where silver pastes (4a,4b) provided over the glass frit pastes are not applied to the insulating layer and electrically contacted with substrate indirectly.