SEMICONDUCTOR PACKAGE MODULE

摘要

PURPOSE: A semiconductor package module is provided to mount a semiconductor chip in the module using two substrates and mount a semiconductor package on the outside of the module, thereby mounting a larger number of semiconductor chips or packages on one semiconductor module. CONSTITUTION: A first semiconductor chip(120) is mounted on a first substrate(100). A first package(140) is mounted on the other surface of the first substrate. The first semiconductor chip is electrically connected with the first connection pad of the first substrate by wire bonding. A second semiconductor chip(220) is mounted on a second substrate(200). A second package(240) is mounted on the lower surface of the second substrate. The space between one side of the first substrate and the top of the second substrate is filled with a filler(400).