| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology of applying a protection tape to a semiconductor wafer, which more effectively inhibits processing defects and peeling failure. <P>SOLUTION: A method for manufacturing a semiconductor device by applying a protection tape 60 having a circumferentially-extending outer periphery to a semiconductor wafer 50 having a circumferentially-extending outer periphery, comprises an edge detection step of detecting a location of an edge 50b of the semiconductor wafer 50 and an application step of positioning the semiconductor wafer 50 by using the detected position and applying the protection tape 60 to a surface of the semiconductor wafer 50. <P>COPYRIGHT: (C)2012,JPO&INPIT |
