发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a high-quality semiconductor device having low-resistance and high-reliability wiring, in a semiconductor device in which electronic components are integrated. <P>SOLUTION: The semiconductor device comprises: signal wiring for transmitting signals; a conductor block that is provided spaced apart from the signal wiring, and contains a metallic material having a higher ionization tendency than that forming the signal wiring; and wiring that connects the signal wiring and the conductor block. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011258872(A) 申请公布日期 2011.12.22
申请号 JP20100133989 申请日期 2010.06.11
申请人 FUJITSU LTD 发明人 KISHII SADAHIRO;KAMIYOSHI GOJI;NAKADA YOSHIHIRO
分类号 H01L23/14;H01L23/12 主分类号 H01L23/14
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