发明名称 LAMINATED ELECTRONIC COMPONENT MANUFACTURING DEVICE AND METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENTS
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component manufacturing device and a method for manufacturing laminated electronic components capable of making facilities smaller, reducing a cost, and efficiently manufacturing high-quality laminated electronic components. <P>SOLUTION: The electronic component manufacturing device comprises: a sheet conveyance member 12 which continuously conveys a ceramic sheet S in a predetermined rotative direction; a sheet transcription member 14 which winds up the ceramic sheet S while moving them in a direction opposite to the direction of rotation of the sheet conveyance member 12; a sheet cutting member 16 which cuts the ceramic sheet S wound up around the sheet transfer member 14 to a predetermined length; and a sheet lamination member 18 to which a cut piece ST of the ceramic sheet S cut to the predetermined length by the sheet cutting member 16 is transferred by lamination from the sheet transfer member 14. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011258932(A) 申请公布日期 2011.12.22
申请号 JP20110089648 申请日期 2011.04.13
申请人 MURATA MFG CO LTD 发明人 NAKAGAWA TAKESHI;SHIROEDA YOSHIHIRO
分类号 H01G13/00;H01G4/12;H01G4/30 主分类号 H01G13/00
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