发明名称 LIGHT EMITTING DIODE PACKAGE HAVING ANODIZED INSULATION LAYER AND FABRICATION METHOD THEREFOR
摘要 An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
申请公布号 US2011312109(A1) 申请公布日期 2011.12.22
申请号 US201113220258 申请日期 2011.08.29
申请人 LEE YOUNG KI;CHOI SEOG MOON;SHIN SANG HYUN;SAMSUNG LED CO., LTD. 发明人 LEE YOUNG KI;CHOI SEOG MOON;SHIN SANG HYUN
分类号 H01L33/48;H01L33/58;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/48
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