发明名称 |
THERMALLY CONDUCTIVE GEL PACKS |
摘要 |
A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. |
申请公布号 |
US2011308781(A1) |
申请公布日期 |
2011.12.22 |
申请号 |
US200913058356 |
申请日期 |
2009.09.24 |
申请人 |
O'RIORDAN EOIN;BLAZDELL PHILIP;WOOD GARY;BUNYAN MICHAEL H.;RUTTI HARISH;PARKER HANNIFIN CORPORATION |
发明人 |
O'RIORDAN EOIN;BLAZDELL PHILIP;WOOD GARY;BUNYAN MICHAEL H.;RUTTI HARISH |
分类号 |
F28F7/00 |
主分类号 |
F28F7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|