| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow miniaturization of a device by efficiently cooling a power semiconductor of the power conversion device. <P>SOLUTION: The power conversion device includes a plurality of power semiconductor elements, a heat receiving member, a plurality of heat pipes, and a plurality of heat radiation fins. The plurality of power semiconductor elements are attached to one side of the heat receiving member. The plurality of heat pipes are attached to the other side of the heat receiving member. At least a part of the plurality of heat pipes has a heat radiation part which is raised from the heat receiving member to the outside of the heat receiving member. The power conversion device comprises the heat pipe installed in such manner that a length direction of a portion of the heat pipe attached to the heat receiving member is in almost the same direction as a flowing direction of a cooling air, and the heat pipe installed in such manner that the length direction of the portion of the heat pipe attached to the heat receiving member is in a direction almost vertical to the flowing direction of the cooling air. <P>COPYRIGHT: (C)2012,JPO&INPIT |
