| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance the uniformity of plasma strength in an electrode plane in a plasma processor. <P>SOLUTION: A plasma processor includes a first electrode that can hold a first substrate, and a second electrode 14 arranged so as to face the first electrode with a plurality of gas supply holes 14a opened to supply gas to be plasma to the plane facing the first electrode, and is provided with grooves 14c so as to surround the gas supply holes 14a on the plane facing the first electrode of the second electrode 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
